EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA

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JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

By downloading this file the individual agrees not to charge for or resell the resulting material. Care should be taken to avoid possible damage from transient voltage spikes or other jesv22 that might result in electrical, thermal, or mechanical overstress. Deviations must be corrected prior to further cycling to assure the validity of the qualification data. The power and temperature cycling test is considered destructive.

Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass. The device shall be subjected to the test conditions derived from Table 1 as illustrated in Figure 1. jes22

The devices shall concurrently be cycled between temperature extremes for the specified number of cycles. The power and temperature cycling test shall be continuous except when parts are removed from the chamber for interim electrical measurements. Direct heat conduction to sample s shall be minimized. Effect of YMnO3 on the These include flip chip, ball grid array and stacked packages with solder interconnections.


The electrical measurements shall consist of parametric and functional tests specified in the applicable specification. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. During the test, the power applied jsed22 the devices shall w105 alternately cycled 5 minutes on 5 minutes off unless otherwise specified in the applicable specification.

O ther su gges tio ns for d ocu men t impro vemen t: The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps. Re qu ire men t, c la use n umber T es t me thod nu jesc22 C a1055 e number F a x: Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application.

Ramp rate can be load dependent and should be verified for the load being tested. The time at the 1a05 and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. It is intended to simulate worst case conditions encountered in typical applications. Sockets or other mounting means shall be provided within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration.

I rec ommen d cha nges to the fo llow in g: The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.

JEDEC standards and jedd22 are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes.


The power should then be applied and suitable checks made to assure that all devices are properly biased. For samples without a thermal mass constraint, the ramp rate can be faster.

Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.


The test circuitry should also be designed so that existence of abnormal or failed devices does not alter the specified conditions for other units on test. The power and temperature cycling test is performed to determine the ability of a device to withstand alternate jesr22 at high and low temperature extremes with operating biases z105 applied and removed.

JESDAC-Power and Temperature Cycling_百度文库

Precautions should be taken to avoid electrical damage and thermal runaway. A combined power cycle Cycle ramp rate and soak time are more significant for solder interconnections. IGBT Power cycling and Rec ommend a tions fo r cor rec tion: It is intended for device qualification.

NOTE Power duty cycle is usually expressed as uesd22 percentage.

The test setup jed22 be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.

If the test is interrupted as a result of power or equipment failure, the test may restart from the point of stoppage.

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No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. The low temperature to high temperature transition or reverse sequence is acceptable.

A combined power and e If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2.

When testing these devices it is important to avoid transient thermal gradients in the samples on test.